Electronic components can be ground and polished to facilitate the examination and identification of failures within the components. The process involves carefully removing a thin layer of the component's surface using grinding and polishing techniques. This exposes the internal structures and allows for a detailed inspection under a microscope or other specialized equipment.
Grinding is typically the initial step, where a coarse abrasive material is used to gradually remove the outer layer of the component, exposing the area of interest. This process is performed with caution to prevent excessive removal or damage to the internal components. Once the grinding phase is complete, polishing follows to smoothen the surface and remove any remaining scratches or imperfections. A fine abrasive material is used during polishing, along with a lubricant or polishing compound, to achieve a smooth and reflective surface.
